TSMC is boosting Arizona chip capacity with a new $100B investment, targeting AI-driven demand and advanced 3nm/2nm nodes.

An oxide pushes the bandgap even further. But will it prove too hot to handle? By Chris Edwards.

Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding ...

A new two-dimensional semiconductor structure sharply reduces resistance where electrical regions meet. The result points ...

Researchers have found a way to build a three-layered silicon chip without the chip overheating.

The writer is a quantum scientist and professor at UCLA  Three of the scientific breakthroughs foundational to quantum ...

Drive around Silicon Valley and you will see surprisingly little skyline. The landscape is dotted with low-rise offices, ...

This dual op-amp version was never released back in the day as EHX boss Mike Matthews felt that it strayed from the traditional Big Muff voicing. But these days we positively embrace fuzz varieties ...

IBM has unveiled the world's first sub-1 nanometer chip technology with its new Nanostack architecture, targeting major gains in AI, cloud and computing ...

IBM has unveiled the world’s first technology capable of manufacturing microchips smaller than 1 nanometer. This comes as tech giants race to build more powerful hardware capable of handling ...

IBM just unveiled the world's first sub 1-nanometer chip: 100 billion transistors. IBM also says they've produced functioning devices with this technology.

IBM's latest chip packs in twice as many transistors as the current state-of-the-art chip by adding a second layer of silicon circuitry ...