Engineering teams must coordinate across hardware and software domains as system-on-chip (SoC) designs scale in complexity.

Chip designers are often stuck between a rock and a hard place. Not only are they dealing with staggering design complexity, but they're also under pressure ...

The recent HBM4 specification announced by JEDEC is great news for developers of AI training hardware. HBM4 is the latest specification in the rapidly ...

Equal1, a global leader in silicon powered quantum computing, has announced a major milestone in quantum computing: the successful validation of a commercial CMOS process.

The global semiconductor manufacturing sector, the invisible engine powering the digital age, is undergoing a profound transformation marked by surging demand for artificial intelligence, intensifying ...

ARQUIMEA has demonstrated BrainChip’s Akida with a Prophesee event-based Metavision® camera on a low-power drone to detect distressed swimmers and surfers, helping lifeguards scale their services for ...

As MCUs take on greater workloads, the conventional bus-based interconnects that once sufficed now limit performance and scalability. Adding artificial intelligence (AI) accelerators, machine learning ...

The rapid growth of mobile computing, AI, and Automotive technologies is driving demand for faster, more efficient, and ...

RIVAI Launched China’s First Fully Self-Developed High- Performance RISC-V Server Chip ...

Siemens Digital Industries Software today announced that Secafy has adopted Siemens’ full IC design flow consisting of its ...

Next-generation AMD EPYC CPU, codenamed “Venice,” is the first HPC product to be brought up on TSMC’s next-generation N2 node ...

The transaction will augment Cadence’s expanding design IP offerings, anchored by a leading portfolio of protocol and interface IP, memory interface IP, SerDes IP at the most advanced nodes, and ...