Puneet Agarwal, chief executive of VVDN Technologies, said its laptop manufacturing process is generating 40% in domestic value addition with its new assembly line—which crosses 50% once designing the ...

Nexperia’s new X.PAK packaging combines high thermal performance, compact size, and easy assembly for high-power applications ...

Many young people have written to the ABC with a similar story: they feel like they did everything "right" but will never achieve what previous generations did. It's a story that defined the past ...