The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

Cadence Design Systems, Inc. ( CDNS) UBS Global Technology and AI Conference 2025 December 2, 2025 4:15 PM EST Hi, everybody. My name is [ Natalia Winkler ]. I'm a semiconductor analyst here at UBS. I ...

Materials informatics combines data analytics and engineering design, streamlining material development and enhancing performance through AI integration.

Discover how in silico tools can be used can be used with organ-on-a-chip for the advancement of ADME studies.

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Improving the design process with Rayon V3, an all-in-one architectural tool integrating AI, data, and collaborative ...

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...

Artificial intelligence and machine learning could become dramatically more efficient, thanks to a new type of computer ...

RFdiffusion2, RFdiffusion3, and Riff-Diff each solve different structural problems in computational enzyme design ...

David Baker's lab at the University of Washington is announcing two major leaps in the field of AI-powered protein design.

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures ...