Materials informatics combines data analytics and engineering design, streamlining material development and enhancing performance through AI integration.
Discover how in silico tools can be used can be used with organ-on-a-chip for the advancement of ADME studies.
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...
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Fully digital design paves the way for scalable probabilistic computing
Artificial intelligence and machine learning could become dramatically more efficient, thanks to a new type of computer ...
RFdiffusion2, RFdiffusion3, and Riff-Diff each solve different structural problems in computational enzyme design ...
Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures ...
A new technical paper “Mitigating hallucinations and omissions in LLMs for invertible problems: An application to hardware ...
Imec pushes 3D HBM-on-GPU technology to extreme limits ...
Week 2 of IndieWire's Top of the Line Craft newsletter deals with doom by enjoying a show about the end of the world. In celebration of the Academy's first year honoring casting with its own Oscar ...
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