Discover how in silico tools can be used can be used with organ-on-a-chip for the advancement of ADME studies.
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...
A new technical paper titled “Chiplet technology for large-scale trapped-ion quantum processors” was published by researchers ...
The novel 3D wiring architecture and chip fabrication method enable quantum processing units containing 10,000 qubits to fit ...