The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

The EDA leader has generated over $500M to date in AI tools and technologies. Now a new data analytics solution applies data management, curation, and analysis across the entire pipeline of chip ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

PITTSBURGH, April 23, 2025 /PRNewswire/ -- Through continued collaboration with TSMC, Ansys (NASDAQ: ANSS) today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has received a TSMC Open Innovation Platform ® (OIP) Ecosystem Forum Customers’ Choice award for ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...