Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...
For use in test as well as field-upgradeable system designs, the SG-BGA-803 socket from Ironwood Electronics is designed to handle 1-mm pitch, 1,521-ball BGAs (39 x 39 ball array, 40 x 40-mm footprint ...
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