A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside ...

Kulicke & Soffa Industries Inc. today said Amkor Technology has indicated it will buy 200 of its Maxum ball bonders for ramping to ultra fine pitch wire bond technology. K&S said it expects to begin ...

The wire bonder equipment market is experiencing steady growth due to increasing demand from various industries such as electronics, telecommunications, and automotive. Companies are investing in ...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...

Kulicke & Soffa Industries Inc. has rolled out an automatic ball bonder machine designed to maximize yield and productivity in high density matrix (HDM) and small outline packages. “The Nu-Tek ...