The MicroSense UltraMap-200C is an automated wafer metrology system designed for high throughput measurement of wafer thickness, flatness, bow and warp. The system features a proprietary dual probe ...
In the last few years, semiconductor circuit features have shrunk to sub-100 nanometer (nm) dimensions, while the size of the thin silicon wafers that these circuits are constructed on has grown from ...
A new instrument under development at the US National Institute of Standards and Technology uses infrared laser light to precisely measure the thickness of 300 millimetre silicon wafers. In the last ...
Biologically active films are crucial in the field of medical devices and sensors, where precision, reliability, and compatibility are essential. Films are usually comprised of biomaterials or ...
Building semiconductors is an incredibly exacting process, with critical dimensions posing significant equipment challenges – and with the possibility that small process excursions can cause the yield ...
MILPITAS, Calif.--(BUSINESS WIRE)--KLA-Tencor (NASDAQ: KLAC) today released its next-generation in-situ plasma etch wafer temperature measurement product, the EtchTemp SensorWafer™. The newest ...
Semiconductor devices are becoming thinner and more complex, making thin deposited films even harder to measure and control. With 3nm node devices in production and 2nm nodes ramping toward ...
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