To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging Built from Kyocera’s ...

USI stated that the combination of low stray inductance, minimal on-resistance, and superior thermal performance delivers a significant boost in energy conversion efficiency and system reliability.

Clorox has patented a method for creating multi-layer substrates using a thermoplastic material that allows for the passage of cleaning compositions between layers. The process involves bonding the ...