South Korean electronics and semiconductor giant Samsung claimed a three-dimensional, stacked memory chip breakthrough this week with new technology that shrinks the space needed for stacked chip ...

TAIPEI — ChipPAC, Inc. said Tuesday that it is ready to move into volume manufacturing with a 1.2mm four-chip stacked-die package, which would include one ASIC. The 10x14mm device is being aimed at ...

Bill Watkins was uncharacteristically quiet when he parted from storage giant Seagate as the company laid off hundreds of employees. But the tough-talking former chief executive didn’t stay down for ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

May 12, 2011, 7:18 PM EDT / Source: GlobeNewswire SAN JOSE, Calif., May 12, 2011 (GLOBE NEWSWIRE) -- Arasan Chip Systems, Inc. ("Arasan"), a leading provider of Intellectual Property (IP) Cores, ...

NAND flash chip vendors including Samsung Electronics and Micron Technology have moved to increase more of their controller chip production to third-party suppliers, such as Phison Electronics and ...

This ElectronicDesign article is reprinted here with permission. Marvell rolled out the first NVMe SSD controllers for cloud and data centers to support the PCIe Gen 5 interconnect, with improvements ...

NAND flash controller chip supplier Phison forecasts that the first quarter will be the low point for annual revenue. As manufacturers successfully adjust prices and DeepSeek drives... Silicon Motion ...

TSMC's demand for CoWoS chipmaking materials has become so great that it is causing material shortages in the memory market. Mitsubishi Gas Chemical has announced to clients that shipments of raw ...

Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...