For use in IoT chemical sensors that can diagnose diseases through breath tests Third-year doctoral student Toshiaki Takahashi, associate professor Kazuhiro Takahashi, and their research team from the ...

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still ...

Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...

TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

Next-generation imaging technology is rapidly expanding beyond smartphones into intelligent devices, robotics, extended ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

A North Carolina-based company has introduced a new type of advanced pressure sensor that can help in semiconductor manufacturing. Developed by Honeywell, the pressure sensor designed for cleanroom ...

GOLETA, CA/ ACCESS Newswire/ April 23, 2025/ Aeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, ...