At the International Solid State Circuits Conference being held in San Francisco this week, IBM Corp. is announcing what it says is a major step forward in solving the multi-core bottleneck; detailing ...

Chipmakers are beginning to incorporate multiple types and flavors of DRAM in the same advanced package, setting the stage for increasingly distributed memory but significantly more complex designs.

For applications where performance is of primary importance, designers have traditionally chosen SRAM technology over DRAM. Although commodity DRAM offers much higher density and a lower cost per bit, ...

In an upgrade that could improve chip performance for gamers and multimedia users, IBM plans to double the performance of its microprocessors in 2008 by using smaller, more efficient memory, according ...

San Jose, Calif. – As the telecom winter drags on, Cisco Systems Inc.'s plan to cut costs by simplifying its diet of electronic components is proving more challenging than expected. Nonetheless, Cisco ...

Researchers propose low-latency topologies and processing-in-network as memory and interconnect bottlenecks threaten inference economic viability ...

KIRKLAND, Wash., Nov. 07, 2022 (GLOBE NEWSWIRE) -- Alliance Memory today announced its technology lineup for electronica 2022, taking place Nov. 15-18 at the Trade Fair Center in Munich, Germany.

It’s been a topsy-turvy period for the memory market, and it’s not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there ...