Building Generative AI models depends heavily on how fast models can reach their data. Memory bandwidth, total capacity, and ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce packaging costs and relax routing constraints in HBM designsSerialization shifts ...

Cohu (COHU) and BE Semiconductor (BESI) were upgraded by Needham on Tuesday, as the investment firm believes the pair will ...

The scaling of computational power within a single, packaged semiconductor component continues to rise following a Moore’s law type curve enabling new and more capable applications including machine ...

Researchers propose low-latency topologies and processing-in-network as memory and interconnect bottlenecks threaten ...

In October 2025, Samsung Electronics and SK Hynix struck a deal with OpenAI, which saw the three companies sign a letter of ...

Micron Technology is thriving in the high bandwidth memory market, leading to a profit beat and strong forecast for the next quarter. The company’s HBM3e shipments are scaling up, with expectations of ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...

ATLANTA--(BUSINESS WIRE)--d-Matrix today officially launched Corsair™, an entirely new computing paradigm designed from the ground-up for the next era of AI inference in modern datacenters. Corsair ...

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced the tapeout of the industry’s first LPDDR6/5X memory IP system solution optimized to operate at 14.4Gbps, up to 50% faster ...

Micron Technology's HBM up-scaling is driving significant profit growth, with profits expected to surge 433% in 2025 and 60% in 2026. Despite disappointing 2Q25 sales guidance, Micron's robust demand ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...