A new technical paper titled “Generative AI for Analog Integrated Circuit Design: Methodologies and Applications” was published by researchers at McMaster University. “Electronic Design Automation ...

More aggressive feature scaling and increasingly complex transistor structures are driving a steady increase in process complexity, increasing the risk that a specified pattern may not be ...

Until now, designing complex metamaterials with specific mechanical properties required large and costly experimental and simulation datasets. The method enables ...

Amid this shift, Interview Kickstart has introduced an advanced machine learning and agentic AI program designed to help ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...