More aggressive feature scaling and increasingly complex transistor structures are driving a steady increase in process complexity, increasing the risk that a specified pattern may not be ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Until now, designing complex metamaterials with specific mechanical properties required large and costly experimental and simulation datasets. The method enables ...

Amid this shift, Interview Kickstart has introduced an advanced machine learning and agentic AI program designed to help ...

Forbes contributors publish independent expert analyses and insights. Writes about the future of finance and technology, follow for more. We live in a world where machines can understand speech, ...