However, effusion cooling technology is difficult to manufacture. In fact this technology requires laser-drilling of thousands of tiny holes with shallow angles on a sheet metal with a thickness ...

As demand for next-generation semiconductor chips grows, a team of researchers has succeeded in laser-drilling the world's tiniest circuit board holes, measuring a near-inconceivable 3 micrometers ...

Four times the holes, four times the trouble. With the fate of repetitive motion injury looming due to the need to drill 1,200 holes, [bitluni] took matters into his own hands and built this nifty ...