Feynman GPUs will feature 3D die stacking, potentially marking the company’s first use of 3D-stacked GPU dies. NVIDIA is turning to custom HBM for Feynman ...

Samsung is considering using Intel’s packaging and glass substrate technology to give its production line a boost. The tie-up between the firms might elevate their game and could finally outperform ...

TL;DR: Samsung Electronics is exploring a strategic partnership with Intel, supported by the US government, to strengthen American semiconductor manufacturing and compete with Taiwan's TSMC. This ...

Despite pouring $16.55 billion into R&D last year, Intel is still losing ground to Samsung and TSMC, whose rapid growth has reshaped the semiconductor race. Backed by U.S. funding and even potential ...

Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.

BARCELONA – Samsung Electronics and Vodafone completed the first call utilizing Samsung’s virtualized radio access network (vRAN) platform and Intel Xeon 6 system-on-chip (SoC), building on the pair's ...

On Thursday, Intel Corp. (NASDAQ: INTC) said it will not accelerate major chip capacity investments without clearer customer commitments, even as rivals Taiwan Semiconductor Manufacturing Co. (NYSE: ...

Samsung Electronics' foundry division is reported to have secured an 8nm manufacturing order from Intel, adding another blue-chip customer to its mature advanced-node portfolio after Nvidia. Analysts ...

The global semiconductor market surged past $830 billion in 2025, driven by AI demand and growth across all major sectors, according to a report from Omdia. DRAM stood out as the fastest-growing ...

According to a report from the Korean outlet Hankyung, Samsung Foundry, the manufacturing division of Samsung Electronics, has reportedly secured a notable client: none other than Intel. The foundry ...