TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...
Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...
Subsidiaries of the Samsung Group will collaborate to invest in the research and development of Glass Core Substrates (GCS) to expedite their commercialization — and which Apple is eyeing, according ...
AMD has been granted a patent (12080632) that covers glass core substrate technology. For those who came in late, glass substrates, made from materials like borosilicate, quartz, and fused silica, ...
The "The Global Market for Glass Substrates for Semiconductors 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Glass Substrate for Semiconductors Market 2026-2036 ...
Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of a glass substrate ...
No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...
Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...
Samsung Electro-Mechanics is gaining an edge in the industry's race to commercialize glass core substrates, a next-generation semiconductor packaging material, by agreeing to establish a joint venture ...
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