Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...

An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...

Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...

PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) here today announced it has licensed proprietary pillar-bumped technology from Singapore-based Advanpack Solutions Pte. Ltd. for flip ...

Apple is continuing its work on the upcoming "M2" chip with help from Samsung Electro-Mechanics, ET News reports. Samsung Electro-Mechanics supplies the flip chip ball grid array (FC-BGA), a printed ...

Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350 million in ...

Samsung Electronics has confirmed that it is preparing for the trial production of flip-chip ball grid array (FC-BGA) in Vietnam and plans to start mass production in July 2023 at its factory in Thai ...

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...

SEOUL, South Korea, May 12, 2025 /PRNewswire/ -- LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the ...

ORLANDO, Fla.--(BUSINESS WIRE)--July 25, 2006--Freescale Semiconductor (NYSE:FSL) (NYSE:FSL.B), the company that developed and introduced the now widely-deployed ball grid array (BGA) packaging ...