PITTSBURGH, May 1, 2019 /PRNewswire/ -- ANSYS (NASDAQ: ANSS), the global leader and innovator of engineering simulation software, announced today that it has acquired substantially all the assets of ...

To support the increasing demand for scalable electromagnetic analysis, Ansys is introducing a new HFSS-IC product family. HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC for its ...

As manufacturers struggle to keep up with demands for smaller, faster, more power-efficient high-performance electronics, one solution from Ansys and Microsoft provides relief. As wireless ...

Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...

AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications / Key Highlights TSMC and Ansys advance AI-assisted workflows to support ...