ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets- FREMONT, Calif., ...
Semiconductor Engineering

Defect Analysis and Testing Framework For FOWLP Interconnects

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...
Nasdaq

ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging ...
Semiconductor Engineering

Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform

“The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the ...
EurekAlert!

Commercialization of Korea's first 600mm large-area semiconductor packaging technology with 6.5x productivity increase

The research team led by Distinguished Research Fellow Dr. Jun-Yeob Song at the Semiconductor Manufacturing Research Center, KIMM, is holding a large rectangular panel developed in collaboration with ...
AZOM

Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025

Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results.