Fig.2. Failure analysis methodologies used in IC development (a) (b) [1] JCH Phang, DSH Chan, M. Palaniappan, JM Chin, B. Davis, M Bruce, “A review of Laser Induced Techniques for Microelectronic ...

Increasing pressure on production costs and, more generally, time to market, have impacted all levels of IC design. In this context, one of the major challenges is to avoid silicon failure or yield ...