CHAM, Switzerland — ESEC Management SA is quietly readying what the Swiss company claims is the world's most advanced, high-speed wire-bonder for chip-packaging applications. The wire-bonder, dubbed ...
Switzerland's ESEC Group, which produces assembly equipment and systems for the semiconductor industry, says it is back in the black. The group suffered huge losses in 1998, due to a massive glut in ...
CHAM, Switzerland — Chip-assembly equipment company ESEC has added a five-micron placement accuracy feature to its Micron 5003 die and flip chip attach machine. The accuracy is qualified with a newly ...
The $470,800 grant was one of three awards nationally by the U.S. Department of Agriculture. ESEC is launching new programming to help entrepreneurs in Maryland and Delaware scale. From farm to market ...
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