In the relentless pursuit of performance and miniaturization, the semiconductor industry has increasingly turned to 3D integrated circuits (3D-ICs) as a cutting-edge solution. Stacking dies in a 3D ...

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Multi-die assemblies are bringing together a variety of materials and processes with distinctly different physical properties, creating significant challenges in manufacturing and packaging that can ...

WASHINGTON & LITTLETON, Colo.--(BUSINESS WIRE)--DISH Network Corporation (NASDAQ: DISH) will leverage the Verica Continuous Verification Platform (CVP) for Kubernetes and Kafka on its 5G Smart ...

The stakes have never been higher for power generation facilities when it comes to extreme cold weather. Severe winter events exposed critical vulnerabilities across the U.S. power grid, leading to ...