IBM and 3M on Wednesday said they will develop new adhesives designed to build silicon towers that will be packaged on 3D semiconductors. The collaboration---IBM brings the semiconductor know-how and ...

IBM and 3M today said they will develop new adhesives designed to build silicon towers that will be packaged on 3D semiconductors. The collaboration--IBM brings the semiconductor know-how and 3M is ...

Yesterday it was the "roof tile" method of stacking memory chips, and today IBM and 3M have announced that they are teaming up to develop a silicon glue that can be used to form "towers" out of ...

IBM and 3M have announced that they will co-develop a special adhesive material that will allow silicon to stack in a tower configuration and will be packaged on 3D semiconductors. IBM plans to stack ...