In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

MOPIC Co., Ltd., a glasses-free 3D technology company, has launched ‘HoloGlass,’ a screen protector-type 3D solution with an integrated 3D lens that transforms smartphone screens into immersive ...

Dowina is an acoustic guitar manufacturer based in Bratislava, Slovakia. In a market brimming with boutique suppliers and numerous well-known brands, a key aspect of Dowina’s market approach is the ...

Southern New Hampshire’s leading landscaping and hardscaping company is redefining outdoor space planning with its innovative use of 3D design technology. With our 3D design services, our clients can ...

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

Check out Electronic Design's coverage of DesignCon 2024. The semiconductor industry is entering the age of the chiplet. Today, many of the world’s most advanced chips consist of several smaller ...

Premium clothing retailer Tommy Hilfiger is implementing 3D design technology into all global apparel design teams at its headquarters in Amsterdam, the Netherlands. The commitment builds on the ...

In a press conference held in Feb. 2025 at 3D Experience World in Houston, Machine Design learned about the Electrospider from Bio3DPrinting. The company was spun off from Italy’s University of Pisa, ...

A custom wooden acoustic diffuser featuring a pixelated portrait of Salvador Dali, handcrafted by WoodXEL, showcasing the blend of advanced 3D design technology and expert craftsmanship. WoodXEL’s ...

California lawsuits and Colorado file limits target 3D printing STL and G-code sharing. With background checks, waiting ...

In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...